Silicone Potting

Silicone Encapsulation

TIC Industries offers a wide range of low stress silicone encapsulates which protect the sensitive electronic components from harsh environment. This silicone encapsulant gives excellent adhesion on different type of substracts.

SP 1000
1,000 – 5,000 cP
SP 2000
6,000 – 10,000 cP
Application examples: Automotive electronic devices, flexible and rigid printed circuit boards and wiring boards.



Product Category:

Silicone Potting
SP 1000 series
SP 2000 series

Product Specifications:

Curing time 25 C 12hr or 80 C 4 hr
Viscosity 1-20 kcps
Tg/ C 90-120

Special features:

  • Low stress, Good thermal-mechanical properties and whether ability
  • Good flow ability & self-levelling
  • Finished Products: